19.5.15
You are invited to attend a lecture
By
Godkin Andrey
Fabrication and Simulation of Electrostatically-formed Nanowire
Abstract
Silicon Nanowires (SiNWs) based field-effect transistors (FETs) are promising sensing devices and building
blocks for logic applications. SiNW based FETs are highly sensitive due to their high surface to volume ratio
and provide ultra-fast switching capabilities.
However, SiNWs FETs are incompatible with mass production mainly because of the complicated
fabrication methods and inhibiting integration into standard semiconductor processing.
The electrostatically-formed Nanowire (EFN) provides an alternative approach combining metal oxide
semiconductor (MOS) FET and JFET like transistors in one device where the conducting channel is
electrostatically tunable in its shape and diameter. Moreover, it is compatible with the standard CMOS
production process. Recently, the EFN was successfully applied as a gas sensor with parts per million (PPM)
sensitivity to ethanol vapor.
The main objective of this thesis was to simulate the fabrication of the second generation EFN conducted
by Tower Jazz, and simulate the electrical and sensing measurements. High-resolution functional imaging
and doping profiling was used to evaluate the process and the produced EFN device. It was found with
Kelvin probe force microscopy in combination with 3D electrostatic simulations that the EFN device is
tunable in its width from 46 to 16 nm.
In addition we demonstrate a threshold Logic with Multiple Gates EFN Transistor. It is a new concept for
integrated circuits, enabling more compact design blocks, reduced silicon chip area and hopefully smaller
power consumption. In addition, we present the concept of a Multiple State EFN Transistor (MSET) that
uses the capability of the EFN to control the position of the channel by applying gate voltages, to navigate
from source to multiple drains. It is predicted to increase logic states from binary to more complex designs
and achieve lower power, switching speed and total footprint of future IC building blocks.
Thursday, May 19, 2015, at 15:00
Room 200, Wolfson building.